Silver 1g Syringe Heat sink Compound Silicone Conductivity Thermal Paste Fluid
The thermal compound comes in a handy syringe for easy application and is enough for 2 CPU's.
Thermal compound improves the efficiency of a heat sink by filling microscopic air gaps that exists between the irregular surfaces of the CPU and the heat sink. In other words, thermal compound increases the thermal conductivity between the CPU and the heat sink which ensures that your CPU runs cooler.
The thermal compound can be used on any combination of CPU and heat sink from PC to games console. Thermal compound is an essential component for doing the XBOX 360 X-Clamp / RROD repair.
Technical details as follows:
- Temperature range: -50°C to +200°C
- Specific resistance: 1 x 1015 Ohms/cm
- Dielectric strength: 18 kV/mm
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